Tae-Sung Jeong

Title: Innovations by Tae-Sung Jeong in Semiconductor Packaging

Introduction

Tae-Sung Jeong is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on innovative methods that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Tae-Sung Jeong's latest patents include two notable methods for manufacturing semiconductor packages. The first patent describes a method that involves mounting a first chip on a first substrate using a flip chip method. This method includes forming at least one bump through soldering, creating a first molding that covers both the first substrate and the first chip, and placing an interposer on the first molding before adding a second substrate with a second chip mounted on it. The second patent outlines a similar method but introduces a cavity formed by etching a metal oxide layer. This method allows for the mounting of a second chip inside the cavity and includes the formation of a via that penetrates the edge of the metal oxide layer.

Career Highlights

Tae-Sung Jeong is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging, making significant strides in manufacturing techniques.

Collaborations

Some of his notable coworkers include Do-Jae Yoo and Young-Do Kweon. Their collaboration has contributed to the development of advanced semiconductor technologies.

Conclusion

Tae-Sung Jeong's contributions to semiconductor packaging through his innovative patents highlight his expertise and commitment to advancing technology in this field. His work at Samsung Electro-Mechanics Co., Ltd. continues to influence the industry positively.