The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Sep. 28, 2010
Do-jae Yoo, Suwon-si, KR;
Young-do Kweon, Seoul, KR;
Joon-seok Kang, Suwon-si, KR;
Chang-bae Lee, Yongin-si, KR;
Do-Jae Yoo, Suwon-si, KR;
Young-Do Kweon, Seoul, KR;
Joon-Seok Kang, Suwon-si, KR;
Chang-Bae Lee, Yongin-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property.