The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Apr. 22, 2008
Hwa-sun Park, Suwon-si, KR;
Sung Yi, Suwon-si, KR;
Sang-chul Lee, Gunpo-si, KR;
Jong-woon Kim, Daejeon, KR;
Yul-kyo Chung, Yongin-si, KR;
Hwa-Sun Park, Suwon-si, KR;
Sung Yi, Suwon-si, KR;
Sang-Chul Lee, Gunpo-si, KR;
Jong-Woon Kim, Daejeon, KR;
Yul-Kyo Chung, Yongin-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.