The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Oct. 19, 2010
Applicants:
Young DO Kweon, Seoul, KR;
Sung Yi, Suwon-si, KR;
Hong-won Kim, Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 1/16 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); H05K 3/062 (2013.01); H05K 3/4626 (2013.01); H05K 3/4652 (2013.01); H05K 3/4655 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09881 (2013.01);
Abstract
A method of manufacturing a capacitor-embedded printed circuit board using a first conductive layer formed on one side of an insulation layer, the method including: forming a second conductive layer on one side of the first conductive layer; forming a second electrode by removing a portion of the second conductive layer; forming a first electrode by removing a portion of the first conductive layer in correspondence with the second electrode; and forming a dielectric layer on one side of the second electrode.