logo

For the Inventor, By the Inventor

Wuhan, China

Siping Hu

This inventor holds 15 USPTO granted patents and 5 published patent applications and 2 EPO patents. Top assignees: Yangtze Memory Technologies Co., Ltd., Yangtze Memory Technologies., Ltd., Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Siping Hu. Retrieved from https://idiyas.com/inventor/siping-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 86.7

 

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Hubei, CN (2016)
  • Wuhan, CN (2021 - 2024)

Company Filing History:

goldMedal12 out of 1,190 
 
Yangtze Memory Technologies Co., Ltd.
 patents
silverMedal2 out of 305 
 
Yangtze Memory Technologies., Ltd.
 patents
bronzeMedal1 out of 82 
 
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2016-2026

Loading Chart...
Loading Chart...
15 patents (USPTO):Explore Patents
1. 12727176 - Three-dimensional memory devices and manufacturing methods thereof and three-dimensional memories (2026-09-01),
2. 12707634 - Three-dimensional integration structure and method of forming the same (2026-08-11),
3. 12507406 - 3D memory device (2025-12-23),
4. 12136599 - Three-dimensional memory devices and fabricating methods thereof (2024-11-05),
5. 12133386 - Contact pads of three-dimensional memory device and fabrication method thereof (2024-10-29),
6. 12089406 - Three-dimensional memory device comprising contact pads exposed by an opening passing through layer stack and fabrication method thereof (2024-09-10),
7. 12080697 - Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures (2024-09-03),
8. 11978719 - Metal-dielectric bonding method and structure (2024-05-07),
9. 11842911 - Wafer stress control using backside film deposition and laser anneal (2023-12-12),
10. 11798913 - Metal-dielectric bonding method and structure (2023-10-24),
11. 11495569 - Metal-dielectric bonding method and structure (2022-11-08),
12. 11450653 - Bonded three-dimensional memory devices having bonding layers (2022-09-20),
13. 11233041 - Bonded three-dimensional memory devices and methods for forming the same (2022-01-25),
14. 11037945 - Bonded three-dimensional memory devices and methods for forming the same (2021-06-15),
15. 9455297 - Preparation process of image sensors (2016-09-27),

Title: The Innovative Journey of Inventor Siping Hu

Introduction: Siping Hu, a talented inventor hailing from Wuhan, China, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Hu's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles and a revolutionary medical device for non-invasive glucose monitoring.

Career Highlights: With over two decades of experience in research and development, Hu has worked for top technology companies in China, leading teams to create innovative solutions in various industries.

Collaborations: Throughout his career, Siping Hu has collaborated with renowned universities and research institutions worldwide, fostering a culture of innovation and knowledge sharing.

Conclusion: Siping Hu's relentless pursuit of innovation and his passion for creating solutions that improve lives make him a true pioneer in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…