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For the Inventor, By the Inventor

Darfo Boario Terme, Italy

Simone Comensoli

USPTO Granted Patents = 82

Average Co-Inventor Count = 26.0

ph-index = 8

Forward Citations = 254(Granted Patents)

DiyaCoin DiyaCoin = 0.03 


Inventors with similar research interests:


Company Filing History:

goldMedal82 out of 203 
 
Pdf Solutions, Incorporated
 patents

Years Active: 2017-2021

where 'Filed Patents' based on already Granted Patents

82 patents (USPTO):
1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),
2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),
5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),
6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),
7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),
8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),
9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),
10. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),
11. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),
12. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),
13. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),
14. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),
15. 10199293 - Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas (2019-02-05),

Title: The Innovative Journey of Inventor Simone Comensoli

Introduction: Simone Comensoli, a talented inventor hailing from Darfo Boario Terme, Italy, has made significant contributions to the world of technology and innovation.

Latest Patents: Simone Comensoli's latest patents include groundbreaking inventions in the field of renewable energy and sustainable materials, showcasing her commitment to creating a greener future for generations to come.

Career Highlights: With a career spanning over two decades, Simone Comensoli has established herself as a pioneer in the development of cutting-edge solutions for environmental challenges. Her innovative approach has led to the successful implementation of various projects aimed at reducing carbon footprint and promoting eco-friendly practices.

Collaborations: Throughout her career, Simone Comensoli has collaborated with leading research institutions, universities, and companies to further her inventions and bring them to the market. Her partnerships have been instrumental in turning her ideas into tangible products that have a positive impact on society.

Conclusion: In conclusion, Simone Comensoli's passion for innovation and dedication to sustainability have positioned her as a prominent figure in the world of inventors. Her relentless pursuit of excellence continues to inspire others to push the boundaries of what is possible in the realm of technology and environmental conservation.

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