Tochigi, Japan

Shiyuki Kanisawa

USPTO Granted Patents = 23 

 

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 108(Granted Patents)


Location History:

  • Utsunomiya, JP (2010)
  • Shinagawa-ku, JP (2018)
  • Tochigi, JP (2009 - 2019)

Company Filing History:


Years Active: 2009-2019

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23 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Shiyuki Kanisawa

Introduction: Shiyuki Kanisawa, an accomplished inventor from Tochigi, Japan, has made significant contributions to the field of adhesive technology. With a remarkable portfolio of 23 patents, he has demonstrated a keen ability to innovate and enhance bonding solutions across various applications.

Latest Patents: Among his most recent inventions are two notable patents: the adhesive agent and connection structure, as well as the adhesive and light-emitting device. The adhesive agent boasts excellent bonding properties with oxide films and superior heat-dissipation capabilities. It comprises an epoxy compound, a cationic catalyst, and an acrylic resin integrated with acrylic acid and hydroxyl group-containing acrylic acid esters. This unique formulation not only establishes robust connections between the acrylic resin and epoxy compound but also enhances adhesive strength by facilitating metal bonding with electrodes. Similarly, the adhesive and light-emitting device leverages the same innovative materials to ensure excellent adhesive strength and strong adhesion to oxide films.

Career Highlights: Shiyuki Kanisawa has lent his expertise to prominent companies such as Dexerials Corporation and Sony Chemical & Information Device Corporation. His work has focused on developing cutting-edge materials that enhance product performance, particularly in the realm of electronics and adhesive applications.

Collaborations: Throughout his career, Kanisawa has collaborated with renowned professionals in the industry, including Hidetsugu Namiki and Hideaki Umakoshi. These partnerships have fostered a collaborative environment that fuels innovation and drives successful research outcomes.

Conclusion: Shiyuki Kanisawa's contributions to adhesive technology exemplify the spirit of innovation. His extensive patent portfolio and successful collaborations highlight his commitment to advancing adhesive applications in various industries. As the demand for high-performance bonding solutions continues to grow, Kanisawa's work will undoubtedly play a critical role in shaping the future of adhesive technology.

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