The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Aug. 19, 2015
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hidetsugu Namiki, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Hideaki Umakoshi, Tochigi, JP;

Masaharu Aoki, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/00 (2006.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); C09J 9/02 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); C23C 14/02 (2006.01); C23C 14/20 (2006.01); C23C 14/22 (2006.01); C08K 7/16 (2006.01); C08K 9/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/00 (2013.01); C09J 9/02 (2013.01); C23C 14/025 (2013.01); C23C 14/205 (2013.01); C23C 14/223 (2013.01); H01L 24/29 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); C08K 7/16 (2013.01); C08K 9/00 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29413 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01);
Abstract

Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.


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