The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Nov. 17, 2014
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hidetsugu Namiki, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Hideaki Umakoshi, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); C09J 9/02 (2006.01); H01L 23/00 (2006.01); H01L 33/60 (2010.01); C08K 3/22 (2006.01); C09J 11/04 (2006.01); C08K 3/08 (2006.01); H01L 33/40 (2010.01); C08K 9/06 (2006.01); C08K 3/24 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C09J 11/04 (2013.01); H01L 24/06 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); C08K 3/24 (2013.01); C08K 9/06 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/2296 (2013.01); H01L 24/48 (2013.01); H01L 33/405 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01081 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01);
Abstract

A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.


Find Patent Forward Citations

Loading…