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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9994743 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

Sep. 09, 2014

Adhesive and light-emitting device

Applicant:

Dexerials Corporation, Shinagawa-ku, JP;

Inventors:

Masaharu Aoki, Shinagawa-ku, JP;

Shiyuki Kanisawa, Shinagawa-ku, JP;

Hidetsugu Namiki, Shinagawa-ku, JP;

Taichi Koyama, Shinagawa-ku, JP;

Akira Ishigami, Shinagawa-ku, JP;

Assignee:

DEXERIALS CORPORATION, Shinagawa-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Rodolfo D Fortich

Int. Cl.
CPC ...
H01L 21/12 (2006.01); C09J 133/20 (2006.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01B 1/22 (2006.01); C09J 133/06 (2006.01); C09J 9/02 (2006.01); C08F 220/18 (2006.01);
U.S. Cl.
CPC ...
C09J 133/20 (2013.01); C08F 220/18 (2013.01); C09J 9/02 (2013.01); C09J 133/066 (2013.01); C09J 163/00 (2013.01); H01B 1/22 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); C08L 2205/22 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2936 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29371 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81487 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83487 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0066 (2013.01);
Abstract

This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

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