The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Sep. 17, 2013
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Akira Ishigami, Tochigi, JP;
Shiyuki Kanisawa, Tochigi, JP;
Hidetsugu Namiki, Tochigi, JP;
Masaharu Aoki, Tochigi, JP;
Assignee:
DEXERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); B23K 35/36 (2006.01); C09J 9/02 (2006.01); H01B 1/22 (2006.01); H01L 33/62 (2010.01); C09J 11/00 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/24 (2006.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01); C08K 9/02 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/36 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/24 (2013.01); C09J 9/02 (2013.01); C09J 11/00 (2013.01); H01B 1/22 (2013.01); H01L 23/5328 (2013.01); H01L 24/29 (2013.01); H01L 33/62 (2013.01); H05K 3/3484 (2013.01); H05K 13/0465 (2013.01); C08K 9/02 (2013.01); C08K 2201/001 (2013.01); H01L 23/3737 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15787 (2013.01);
Abstract
An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.