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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9676066 B1

PDFFull Text
Date of Patent:
Jun. 13, 2017

Filed:

Sep. 17, 2013

Anisotropic conductive adhesive

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Akira Ishigami, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Hidetsugu Namiki, Tochigi, JP;

Masaharu Aoki, Tochigi, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Benjamin Sandvik

Int. Cl.
CPC ...
H01L 23/532 (2006.01); B23K 35/36 (2006.01); C09J 9/02 (2006.01); H01B 1/22 (2006.01); H01L 33/62 (2010.01); C09J 11/00 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/24 (2006.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01); C08K 9/02 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/36 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/24 (2013.01); C09J 9/02 (2013.01); C09J 11/00 (2013.01); H01B 1/22 (2013.01); H01L 23/5328 (2013.01); H01L 24/29 (2013.01); H01L 33/62 (2013.01); H05K 3/3484 (2013.01); H05K 13/0465 (2013.01); C08K 9/02 (2013.01); C08K 2201/001 (2013.01); H01L 23/3737 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15787 (2013.01);
Abstract

An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.

Find Patent Forward Citations

Quick Actions:

Ishigami, Akira. (2017). Anisotropic conductive adhesive (U.S. Patent No. 9676066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9676066

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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