The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Feb. 13, 2015
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hidetsugu Namiki, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Masaharu Aoki, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); C09J 9/02 (2006.01); H01L 33/62 (2010.01); C09J 11/04 (2006.01); H01L 33/60 (2010.01); C09J 163/00 (2006.01); C08K 9/02 (2006.01); C08K 3/22 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08K 3/22 (2013.01); C08K 9/02 (2013.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/644 (2013.01); H01L 33/647 (2013.01); C08K 2003/2241 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.


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