The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Apr. 13, 2011
Applicants:

Hidetsugu Namiki, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Hideaki Umakoshi, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Inventors:

Hidetsugu Namiki, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Hideaki Umakoshi, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); C09J 11/04 (2006.01); C09J 9/02 (2006.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); C08K 3/22 (2006.01); C08K 9/06 (2006.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 33/62 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01082 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/29339 (2013.01); H01L 2924/12041 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01046 (2013.01); C09J 11/04 (2013.01); H01L 2924/0665 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/01057 (2013.01); C08K 2003/2296 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/01078 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/29101 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01019 (2013.01); H01L 24/29 (2013.01); C09J 9/02 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/29198 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/10157 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01004 (2013.01); H01L 2224/48091 (2013.01); H01L 33/60 (2013.01); C08K 9/06 (2013.01); H01L 2924/014 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83855 (2013.01); H01L 33/405 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01056 (2013.01); H01L 24/17 (2013.01); H01L 24/83 (2013.01); H01L 2924/0103 (2013.01); H01L 24/06 (2013.01); C08K 3/22 (2013.01);
Abstract

A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.


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