Dexerials Corporation

Sony Chemical & Information Device Corporation

Sony Corporation

Sony Corporation & Information Device Corporation

Shiyuki Kanisawa

Hidetsugu Namiki

Hideaki Umakoshi

Akira Ishigami

Masaharu Aoki

Genki Katayanagi

Takashi Matsumura

Yasuhiro Suga

Noriaki Kudo

Hisashi Ando

Yoshihisa Shinya

Katsuhiro Tomoda

Hiroyuki Kumakura

Taichi Koyama

An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

Adhesive agent and connection structure

This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

Adhesive and light-emitting device

An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.

Anisotropic conductive adhesive

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are formed by subjecting titanium oxide particles to a surface treatment with one kind selected from the group consisting of AlO, SiO, SiO, ZnO, ZnO, and ZrO. The amount of the titanium oxide contained in the light-reflective insulating particles is 85 to 93%. The particle diameter of the light-reflective insulating particles is 0.2 to 0.3 &#x3bc;m, and the particle diameter of the conductive particles is 2 to 10 &#x3bc;m.

Light-reflective anisotropic conductive adhesive and light-emitting device

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin.

Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.

Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive

An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35&#xb0; C., 55&#xb0; C., 95&#xb0; C., and 150&#xb0; C. of a cured product of the anisotropic conductive adhesive are denoted by EM, EM, EM, and EM, respectively, and change rates in the elastic modulus between 55&#xb0; C. and 95&#xb0; C. and between 95&#xb0; C. and 150&#xb0; C. are denoted by &#x394;EMand &#x394;EM, respectively, the following expressions (1) to (5) are satisfied700 Mpa&#x2266;EM&#x2266;3000 MPa&#x2003;&#x2003;(1)EM&#x3c;EM&#x3c;EM&#x3c;EM&#x2003;&#x2003;(2)&#x394;EM&#x3c;&#x394;EM&#x2003;&#x2003;(3)20%&#x2266;&#x394;EM&#x2003;&#x2003;(4)40%&#x2266;&#x394;EM&#x2003;&#x2003;(5).

A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.

Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device

A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.

Light-reflective anisotropic conductive adhesive agent, and light emitting device

A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.

Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device

A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.

An anisotropic conductive adhesive including conductive particles dispersed in an epoxy-based adhesive containing an epoxy compound and a curing agent gives a cured product having the elastic modulus satisfying the expressions (1) to (5), in which EM, EM, EM, and EMare values of the elastic modulus of the cured product at 35&#xb0; C., 55&#xb0; C., 95&#xb0; C., and 150&#xb0; C., respectively, &#x394;EMis the rate of change in the elastic modulus between 55&#xb0; C. and 95&#xb0; C., and &#x394;EMis the rate of change in the elastic modulus between 95&#xb0; C. and 150&#xb0; C.,700 MPa&#x2266;EM&#x2266;3000 MPa&#x2003;&#x2003;(1)EM&#x3c;EM&#x3c;EM&#x3c;EM&#x2003;&#x2003;(2)&#x394;EM&#x3c;&#x394;EM&#x2003;&#x2003;(3)20%&#x2266;&#x394;EM&#x2003;&#x2003;(4)40%&#x2266;&#x394;EM&#x2003;&#x2003;(5).

Growing community of inventors

Tochigi, Japan

Shiyuki Kanisawa