The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Mar. 21, 2014
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hidetsugu Namiki, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Hideaki Umakoshi, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01B 1/02 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01B 1/22 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01); C08G 59/42 (2006.01); H01L 33/46 (2010.01); C08K 9/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01B 1/22 (2013.01); H01L 33/46 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C08K 9/02 (2013.01); C09J 163/00 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/45144 (2013.01); C08G 59/42 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29447 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/81903 (2013.01); H01L 2924/07811 (2013.01);
Abstract

A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.


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