The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Jul. 22, 2010
Applicants:
Hidetsugu Namiki, Tochigi, JP;
Shiyuki Kanisawa, Tochigi, JP;
Hideaki Umakoshi, Tochigi, JP;
Inventors:
Assignee:
Dexerials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); C08G 59/42 (2006.01); C08L 63/00 (2006.01); C09J 11/04 (2006.01); C08L 23/02 (2006.01); C09J 123/02 (2006.01); C09J 9/02 (2006.01); C08K 3/08 (2006.01); H01L 23/00 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); H01L 2924/01004 (2013.01); H01L 2224/29347 (2013.01); H01L 2924/01015 (2013.01); C08K 3/08 (2013.01); C08G 59/42 (2013.01); C08L 63/00 (2013.01); H01L 2224/48227 (2013.01); C09J 11/04 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/45147 (2013.01); C08L 23/02 (2013.01); H01L 2224/29499 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/29655 (2013.01); H01L 2224/29647 (2013.01); C09J 123/02 (2013.01); H01L 2924/01012 (2013.01); H01L 2224/29644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/29447 (2013.01); H01L 33/60 (2013.01); H01L 2924/01029 (2013.01); H01L 24/32 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/29344 (2013.01); H01L 24/16 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/29355 (2013.01); H01L 24/83 (2013.01); C08K 9/02 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29455 (2013.01); H01L 2924/01046 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/00013 (2013.01); H01L 2224/2929 (2013.01); H01L 24/29 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/29444 (2013.01); H01L 2924/01078 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/2939 (2013.01); H01L 2924/01057 (2013.01); H01L 2224/73204 (2013.01);
Abstract
A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.