The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Mar. 14, 2012
Applicants:

Hideaki Umakoshi, Tochigi, JP;

Hidetsugu Namiki, Tochigi, JP;

Masaharu Aoki, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Inventors:

Hideaki Umakoshi, Tochigi, JP;

Hidetsugu Namiki, Tochigi, JP;

Masaharu Aoki, Tochigi, JP;

Akira Ishigami, Tochigi, JP;

Shiyuki Kanisawa, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/00 (2006.01); C08L 83/00 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01B 3/00 (2006.01); C08G 77/38 (2006.01); C09J 183/06 (2006.01); H01B 1/22 (2006.01); H01L 33/46 (2010.01); C09J 9/02 (2006.01); C08K 5/09 (2006.01); C08G 77/12 (2006.01); C08K 3/22 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/62 (2013.01); C08K 5/09 (2013.01); C08G 77/12 (2013.01); C08K 2003/2296 (2013.01); H01L 33/60 (2013.01); H01L 2224/45144 (2013.01); H01B 3/00 (2013.01); C08K 2003/2241 (2013.01); C08G 77/38 (2013.01); C09J 183/06 (2013.01); C08K 5/0025 (2013.01); H01B 1/22 (2013.01); H01L 2224/48227 (2013.01); C09J 9/02 (2013.01);
Abstract

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.


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