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For the Inventor, By the Inventor

Saitama, Japan

Satoshi Haruyama

This inventor holds 19 USPTO granted patents. Top assignee: Nippon Cmk Corp.. Active years: 1989-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satoshi Haruyama. Retrieved from https://idiyas.com/inventor/satoshi-haruyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 10

Forward Citations = 227(Granted Patents)


Location History:

  • Saitama, JP (1989 - 1994)
  • Iruma, JP (1991 - 1994)

Company Filing History:

goldMedal19 out of 61 
 
Nippon Cmk Corp.
 patents

Years Active: 1989-1994

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19 patents (USPTO):Explore Patents
1. 5308644 - Method for manufacturing a printed wiring board having a shield layer (1994-05-03),
2. 5294755 - Printed wiring board having shielding layer (1994-03-15),
3. 5268535 - Printed wiring board (1993-12-07),
4. 5268194 - Method of packing filler into through-holes in a printed circuit board (1993-12-07),
5. 5234745 - Method of forming an insulating layer on a printed circuit board (1993-08-10),
6. 5220135 - Printed wiring board having shielding layer (1993-06-15),
7. 5219607 - Method of manufacturing printed circuit board (1993-06-15),
8. 5191709 - Method of forming through-holes in printed wiring board (1993-03-09),
9. 5145691 - Apparatus for packing filler into through-holes or the like in a printed (1992-09-08),
10. 5133120 - Method of filling conductive material into through holes of printed (1992-07-28),
11. 5100695 - Method of manufacturing a printed circuit board (1992-03-31),
12. 5030800 - Printed wiring board with an electronic wave shielding layer (1991-07-09),
13. 5028743 - Printed circuit board with filled throughholes (1991-07-02),
14. 4991060 - Printed circuit board having conductors interconnected by foamed (1991-02-05),
15. 4929491 - Printed wiring board (1990-05-29),

Title: Satoshi Haruyama: Innovator in Printed Wiring Board Technology

Introduction

Satoshi Haruyama, an esteemed inventor based in Saitama, Japan, has made significant contributions to the field of electronic manufacturing. With an impressive portfolio of 19 patents, he is widely recognized for his innovative techniques in the production of printed wiring boards. His dedication to advancing technology in this area reflects a commitment to improving electronic component design and functionality.

Latest Patents

Among his latest patents, two notable inventions stand out. The first is a patent for a method for manufacturing a printed wiring board having a shield layer. This innovative method allows for the creation of shield layers on printed wiring circuits while ensuring effective pressure injection of the coating through a mask. The second patent details a printed wiring board having a shielding layer designed specifically for integrated circuits. This product features an insulating sheet with a connecting through hole portion and an electromagnetic shielding layer, enhancing the performance and reliability of electronic devices.

Career Highlights

Satoshi Haruyama's career is marked by his tenure at Nippon Cmk Corp., where he has been instrumental in developing advanced manufacturing processes. His extensive knowledge of printed wiring technology has not only led to numerous patents but has also positioned him as a leading figure in the industry. His innovative approaches have consistently prioritized efficiency and performance in electronic component manufacturing.

Collaborations

Collaboration plays a vital role in Haruyama's success. He has worked alongside talented colleagues such as Shin Kawakami and Hirotaka Okonogi, fostering an environment of creativity and innovation. Together, they have pushed the boundaries of existing technology, leading to groundbreaking advancements in printed wiring board fabrication.

Conclusion

Satoshi Haruyama's contributions to the field of printed wiring board technology have established him as a prominent inventor in Japan. With his vast experience, prolific patent portfolio, and collaborative efforts, he continues to influence the evolution of electronic manufacturing. His innovations not only reflect his technical expertise but also symbolize a relentless pursuit of excellence in the realm of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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