The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1992
Filed:
Mar. 22, 1991
Nippon CMK Corp., , JP;
Abstract
An apparatus for packing a filler of conductive material into through-holes in a printed circuit board comprises a packing nozzle, an mask and a covering plate. The packing nozzle delivers a filler of conductive material through a delivery opening, and a delivery valve is mounted at the delivery opening. A manipulator is provided on the upper part of the nozzle for manipulating the delivery valve, and a nozzle tip is attachable to and detachable from the delivery opening. The mask has packing holes disposed in positions corresponding to those of the through-holes in the printed circuit board, and the mask is mountable on the upper side of the printed circuit board. The covering plate has escape holes in positions corresponding to those of through-holes in the printed circuit board, and the covering plate is disposable on the lower side of the printed circuit board. A squeegee may be provided on the lower part of the nozzle. The apparatus make it possible to attain a uniform and stable packing of filler into the through-holes without being affected by the thickness of the printed circuit board, the size of the through-hole diameter, or the fluidity of the filler.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile