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Nippon Cmk Corp.

USPTO Granted Patents = 61

Forward Citations = 541

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32 inventors (with patents filed for the assignee):

Shin Kawakami (33 out of 33 patents)

Hirotaka Okonogi (28 out of 28 patents)

Satoshi Haruyama (19 out of 19 patents)

4. Isamu Kubo (13 out of 13 patents)

5. Junichi Ichikawa (12 out of 12 patents)

6. Katsutomo Nikaido (11 out of 11 patents)

7. Kameharu Seki (9 out of 9 patents)

8. Yoshio Nishiyama (5 out of 5 patents)

9. Yasuaki Otani (4 out of 4 patents)

10. Yasuaki Ohtani (3 out of 3 patents)

11. Katutomo Nikaido (3 out of 3 patents)

12. Norito Mukai (3 out of 3 patents)

13. Kohji Ohtake (2 out of 2 patents)

14. Kazuo Hayashi (2 out of 2 patents)

15. Junichi Itsuji (2 out of 2 patents)

Core Competencies:

Electromagnetic Shielding

Printed Circuit Board

Manufacturing Method

Through-Holes

Insulating Layer

Microcircuit Patterns

Filler Packing

Silk Screen Fabric

61 patents: Sort by Forward Citations

1. 5416667 - Printed wiring board having an electromagnetic wave shielding layer (1995-05-16),

2. 5404637 - Method of manufacturing multilayer printed wiring board (1995-04-11),

3. 5308644 - Method for manufacturing a printed wiring board having a shield layer (1994-05-03),

4. 5304392 - Method of manufacturing printed wiring board (1994-04-19),

5. 5296082 - Mold for printed wiring board (1994-03-22),

6. 5294755 - Printed wiring board having shielding layer (1994-03-15),

7. 5293004 - Printed circuit board having an electromagnetic shielding layer (1994-03-08),

8. 5291653 - Manufacturing printed wiring boards having electromagnetic wave shielding (1994-03-08),

9. 5277929 - Method for masking through holes in manufacturing process of printed (1994-01-11),

10. 5277787 - Method of manufacturing printed wiring board (1994-01-11),

11. 5274915 - Method of manufacturing a printed wiring board (1994-01-04),

12. 5268535 - Printed wiring board (1993-12-07),

13. 5268194 - Method of packing filler into through-holes in a printed circuit board (1993-12-07),

14. 5266904 - Printed circuit board with through-holes including a test land having (1993-11-30),

15. 5266748 - Printed wiring board having through-holes covered with ink layer and (1993-11-30),

Company Overview

Nippon Cmk Corp., headquartered in Isesaki, Japan, specializes in the development and manufacturing of printed wiring boards. The company focuses on advanced technologies such as electromagnetic shielding and innovative manufacturing methods for printed circuit boards. Their expertise encompasses various core technology topics, including through-holes, insulating layers, microcircuit patterns, filler packing, and silk screen fabric. This positions Nippon Cmk as a key player in the electronics industry, catering to diverse applications and enhancing circuit performance.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

61 Patents

#4 in Isesaki

#1,512 in Japan

#11,914 in the World

Nippon Cmk Corp.

Forward Citations = 541

32 inventors:

Shin Kawakami (33 out of 33 patents)

Hirotaka Okonogi (28 out of 28 patents)

Satoshi Haruyama (19 out of 19 patents)

4. Isamu Kubo (13 out of 13 patents)

5. Junichi Ichikawa (12 out of 12 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nippon Cmk Corp.. Retrieved from https://idiyas.com/company/nippon-cmk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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