The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 1994

Filed:

Jan. 06, 1992
Applicant:
Inventor:

Masuo Matsumoto, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ; B44C / ;
U.S. Cl.
CPC ...
427 96 ; 427259 ; 427282 ; 1566611 ;
Abstract

According to the present invention, inequality in the film thickness of the solder resist and the occurrence of the blur can be eliminated, and it is possible to perform a screen printing for the solder resist with a minute pattern which leads to the formation of a minute solder land. A solder resist 60 is screen printed while leaving an etching resist 3 in the step for forming a printed wiring circuit 5 on the front of an insulating board 4. Afterward, the etching resist and the overlaid solder resist 60a are simultaneously removed, thereby forming a flat surface over the printed wiring circuit 5.


Find Patent Forward Citations

Matsumoto, Masuo. (1994). Method of manufacturing printed wiring board (U.S. Patent No. 5304392). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5304392

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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