The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 1994
Filed:
Aug. 02, 1991
Applicant:
Inventors:
Assignee:
Nippon CMK Corp., , JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427 96 ; 427404 ; 427405 ;
Abstract
The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.
Kawakami, Shin. (1994). Method for manufacturing a printed wiring board having a shield layer (U.S. Patent No. 5308644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5308644
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile