Saitama, Japan

Shin Kawakami

This inventor holds 33 USPTO granted patents, primarily in Printed Circuit Board Technology. Top assignee: Nippon Cmk Corp.. Active years: 1989-1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shin Kawakami. Retrieved from https://idiyas.com/inventor/shin-kawakami

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 13

Forward Citations = 372(Granted Patents)


Location History:

  • Fujikubo, JP (1992 - 1993)
  • Saitama, JP (1989 - 1994)
  • Iruma, JP (1991 - 1995)

Company Filing History:


Years Active: 1989-1995

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Areas of Expertise:
Printed Wiring Board
Electromagnetic Shielding
Multilayer Manufacturing
Through-Holes
Screen Printing
Insulating Layer
Microcircuit Patterns
Conductive Material
33 patents (USPTO):Explore Patents

Title: Innovations by Shin Kawakami: A Pioneer in Printed Wiring Board Technology

Introduction

Shin Kawakami, an accomplished inventor based in Saitama, Japan, has made significant contributions to the field of printed wiring board technology. With a remarkable portfolio of 33 patents, Kawakami continues to push the boundaries of innovation and design, making strides in the advancement of electronic components and their manufacturing methods.

Latest Patents

Kawakami's latest patents showcase his ingenuity and focus on improving functionality and visual inspection in printed wiring boards. His first patent involves a printed wiring board that features an electromagnetic wave shielding layer. This board comprises a substrate, a printed wiring circuit, an insulating layer, and importantly, an electromagnetic wave shielding layer topped with a distinguishable overcoat layer. By using contrasting colors for these layers, visual inspection of the board's working condition is improved.

Another of his notable patents details a method of manufacturing multilayer printed wiring boards. This method includes forming a through-hole in the substrate of the board, inserting fine wires into it, and filling the hole with molten solder through capillary action. This innovation not only enhances electrical connectivity but also streamlines the manufacturing process by potentially incorporating a mesh sheet of fine wires.

Career Highlights

Kawakami's extensive innovations have positioned him as a key figure at Nippon CMK Corporation, where he continues to pioneer technology in the electronic circuit industry. His experience and expertise in printed wiring board design have garnered him recognition among peers and industry professionals alike.

Collaborations

Collaboration plays a crucial role in Kawakami's success. He works alongside notable colleagues such as Hirotaka Okonogi and Satoshi Haruyama. Together, they contribute to groundbreaking projects that seek to advance the technology and efficiency of electronic components in various applications.

Conclusion

Shin Kawakami stands as a testament to the impact of innovation in technology. His ongoing work at Nippon CMK Corporation and the impressive array of patents he holds reflect his dedication to enhancing electronic systems. As the demand for sophisticated electronic devices continues to grow, Kawakami’s inventions will undoubtedly play a pivotal role in shaping the future of printed wiring board technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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