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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5266748 B1

PDFFull Text
Date of Patent:
Nov. 30, 1993

Filed:

Mar. 15, 1991

Printed wiring board having through-holes covered with ink layer and

Applicant:
Inventors:

Shin Kawakami, Saitama, JP;

Hirotaka Okonogi, Saitama, JP;

Katsutomo Nikaido, Saitama, JP;

Junichi Ichikawa, Saitama, JP;

Yoshio Nishiyama, Saitama, JP;

Assignee:

Nippon CMK Corp., , JP;

Attorneys:

Adams; Bruce L.

Wilks; Van C.

Primary Examiner:

Leo P Picard

Assistant Examiner:

Cheryl R Figlin

Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174262 ; 174260 ; 174264 ; 361767 ; 361818 ;
Abstract

A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. The ink layer may be formed simultaneously with the printing of symbols of electronic parts to be mounted on the printed wiring board.

Find Patent Forward Citations

Kawakami, Shin. (1993). Printed wiring board having through-holes covered with ink layer and (U.S. Patent No. 5266748). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5266748

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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