The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 1993
Filed:
Oct. 31, 1990
Applicant:
Inventors:
Assignee:
Nippon CMK Corp., , JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
428209 ; 427 96 ; 428901 ; 430315 ;
Abstract
A method of forming an insulating layer on a printed circuit board for use in a manufacture of the printed circuit board is disclosed. The method comprises steps of providing a base material plate for the printed circuit board, forming a circuit pattern on the base material plate, providing an insulating layer on the circuit pattern, providing a conducting circuit on the insulating layer, and forming the insulating layer by a dry film.
Kawakami, Shin. (1993). Method of forming an insulating layer on a printed circuit board (U.S. Patent No. 5234745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5234745
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile