The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1993
Filed:
Jul. 22, 1991
Nippon CMK Corp., , JP;
Abstract
A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower openings of the through-holes by means of squeegees. In this method, the mask may be a silk screen provided with open-worked packing holes for packing the filler in the positions corresponding to those in which the through-holes of said printed circuit board are packed. In the above method, the filler may be packed by delivering pressurized filler from a packing nozzle, which comprises 1) a packing means connected both to a manipulation means for actuating a delivery valve for delivering the filler from said nozzle tip and to a supply means for supplying the filler and 2) a nozzle tip attached to the delivery end of said packing nozzle. In the above-described method, said filler may be a solvent-less filler.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile