The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 1994
Filed:
Jun. 18, 1991
Yasunori Matsushima, Saitama, JP;
Kunio Nishi, Saitama, JP;
Nippon CMK Corp., , JP;
Abstract
The invention has been achieved to solve the problem mentioned above. The object of the invention is to provide a novel method of manufacturing a printed wiring board by allowing manufacturers to provide a slit and perforations on the substrate without causing even the slightest crack to be generated in the course of manufacturing the printed wiring board. In the course of manufacturing printed wiring boards splittable across a slit and perforations,the method embodied by the invention executes those sequential steps including the following; provision of thickness adjusting film for specific regions adjacent to the slit and perforations; adjustment of the thickness of a main substrate and a splittable substrate which is splittable by means of the slit and the perforations; and formation of the slit and the perforations by applying a pressing and punching process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile