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For the Inventor, By the Inventor

Saitama, Japan

Isamu Kubo

This inventor holds 13 USPTO granted patents. Top assignees: Nippon Cmk Corp., Iwase Sangyo Co., Itohdenki Kanto Hanbai. Active years: 1989-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Isamu Kubo. Retrieved from https://idiyas.com/inventor/isamu-kubo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13

% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 6

Forward Citations = 80(Granted Patents)


Location History:

  • Miyoshi, JP (1990)
  • Isesaki, JP (1990 - 1992)
  • Fujikubo, JP (1992)
  • Saitama, JP (1989 - 1994)

Company Filing History:

goldMedal13 out of 61 
 
Nippon Cmk Corp.
 patents
silverMedal2 out of 2 
 
Iwase Sangyo Co.
 patents
bronzeMedal1 out of 1 
 
Itohdenki Kanto Hanbai
 patent
4. 1 out of 1 
 
Itohdenki Kanto Hanbai Co.
 patent
where one patent can have more than one assignee

Years Active: 1989-1994

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13 patents (USPTO):Explore Patents
1. 5296082 - Mold for printed wiring board (1994-03-22),
2. 5277929 - Method for masking through holes in manufacturing process of printed (1994-01-11),
3. 5238524 - Hole masking apparatus (1993-08-24),
4. 5180465 - Etching method of forming microcircuit patterns on a printed circuit (1993-01-19),
5. 5169477 - Etching apparatus for forming microcircuit patterns on a printed circuit (1992-12-08),
6. 5096524 - Method for automatically stretching a silk screen fabric on a silk (1992-03-17),
7. 4978414 - Apparatus for stretching silk including means to move cramp members (1990-12-18),
8. 4976573 - Apparatus for chamfering planar plate (1990-12-11),
9. 4975136 - Method of filler taping screen frame and method of filling screen frame (1990-12-04),
10. 4972630 - Method of surface grinding of planar member (1990-11-27),
11. 4969296 - Apparatus of surface grinding of planar member (1990-11-13),
12. 4925347 - Method of chamfering planar plate (1990-05-15),
13. 4856424 - Apparatus for filler taping screen frame and apparatus for applying (1989-08-15),

Title: Isamu Kubo: Innovator in Printed Circuit Board Technology

Introduction

Isamu Kubo is a prominent inventor based in Saitama, Japan, known for his significant contributions to the field of printed circuit board technology. With a total of 13 patents to his name, Kubo has developed innovative solutions that enhance the manufacturing processes of printed wiring boards.

Latest Patents

Among his latest patents is a mold for printed wiring boards, which is designed to facilitate the production of these essential components. This mold consists of upper and lower dies that sandwich the printed wiring board, allowing for drilling and punching operations. Notably, one of the dies features a press surface with concave or convex portions that absorb steps caused by the formation of printed wiring circuits. Another significant patent involves a method for masking through-holes during the manufacturing process of printed circuit boards. This method includes the use of a removable masking seal made from soluble, light-setting, or thermo-setting materials to cover specific through-holes, ensuring precision in the filling process.

Career Highlights

Kubo has worked with notable companies such as Nippon CMK Corporation and Iwase Sangyo Co., where he has applied his expertise in circuit board technology. His work has contributed to advancements in manufacturing techniques and product quality in the electronics industry.

Collaborations

Throughout his career, Kubo has collaborated with esteemed colleagues, including Kameharu Seki and Yasuaki Otani. These partnerships have fostered innovation and have played a crucial role in the development of new technologies in the field.

Conclusion

Isamu Kubo's contributions to printed circuit board technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the manufacturing processes that are vital to modern electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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