The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 1992
Filed:
Nov. 29, 1989
Applicant:
Inventors:
Assignee:
Nippon CMK Corp., , JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427 96 ; 4271263 ;
Abstract
A method of manufacturing a printed circuit board for use in an electronic circuit is disclosed. The method comprises steps of forming a printed circuit on an insulating base board, of forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and of adhering the conductive ink through an uneven surface formed on a terminal portion to be connected to the printed circuit.
Kawakami, Shin. (1992). Method of manufacturing a printed circuit board (U.S. Patent No. 5100695). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5100695
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile