The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
Jun. 12, 1991
Applicant:
Inventors:
Assignee:
Nippon CMK Corp., , JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427 96 ; 427 58 ; 4271263 ;
Abstract
A method of manufacturing a printed circuit comprising the following steps: in a connection portion of a printed circuit formed on an insulating substrate, another circuit portion such as a jumper circuit is applied with resin ink; and a connection circuit for the circuit terminal portion of said printed circuit is formed by applying electroconductive ink.
Kawakami, Shin. (1993). Method of manufacturing printed circuit board (U.S. Patent No. 5219607). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5219607
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile