The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1993
Filed:
Aug. 02, 1991
Applicant:
Inventors:
Assignee:
Nippon CMK Corp., , JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K / ;
U.S. Cl.
CPC ...
29852 ; 174263 ; 228 33 ; 427 97 ;
Abstract
In the method for forming through-holes of the present invention, by injecting a conductive material into the through-holes by means of a filling nozzle while removing the excessive conductive material with a squeegee, the filling can quickly and uniformly be performed independently of the board thickness of the substrate and the number and diameter of the through-holes.
Kawakami, Shin. (1993). Method of forming through-holes in printed wiring board (U.S. Patent No. 5191709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5191709
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