The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 1991

Filed:

Nov. 24, 1989
Applicant:
Inventors:

Shin Kawakami, Saitama, JP;

Satoshi Haruyama, Saitama, JP;

Hirotaka Okonogi, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361410 ; 174261 ; 361406 ;
Abstract

A printed circuit board has a vibration-absorbing electroconductive body disposed in a through-hole to electrically interconnect electrical conductors disposed on opposed sides of the board. The electroconductive body is formed from the expansion of a decomposed, foamed electroconductive paste which is heated and hardened to form the electroconductive body.


Find Patent Forward Citations

Kawakami, Shin. (1991). Printed circuit board having conductors interconnected by foamed (U.S. Patent No. 4991060). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4991060

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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