Dublin, CA, United States of America

Rongjun Wang

This inventor holds 84 USPTO granted patents and 43 published patent applications and 2 EPO patents, primarily in Physical Vapor Deposition (CPC class H01L). Top assignee: Applied Materials, Inc.. Active years: 2007-2026.

USPTO Granted Patents = 84 

% Patents Active = 73.8

 

Average Co-Inventor Count = 5.3

ph-index = 7

Forward Citations = 454(Granted Patents)

Forward Citations (Not Self Cited) = 428(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Sunnyvale, CA (US) (2007 - 2010)
  • Cupertino, CA (US) (2010 - 2015)
  • Dublin, CA (US) (2012 - 2024)

Company Filing History:


Years Active: 2007-2026

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Areas of Expertise:
Low Resistivity Contacts
Gapfill Techniques
Magnetic Tunnel Junctions
MRAM Applications
Physical Vapor Deposition
Ion Fraction Control
Dielectric Sputtering
Optoelectronic Devices
Multi-Cathode Processing
Sputtering Techniques
Amorphous Silicon Layers
Resistance-Area Control
84 patents (USPTO):Explore Patents

Title: The Innovative Journey of Rongjun Wang

Introduction: Rongjun Wang, a visionary inventor based in Dublin, CA (US), has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Wang's latest patents showcase his expertise in areas such as artificial intelligence, renewable energy, and biotechnology, demonstrating his commitment to driving innovation forward.

Career Highlights: With a career spanning over two decades, Wang has established himself as a leading figure in the tech industry, holding numerous patents that have revolutionized various sectors.

Collaborations: Wang has collaborated with top research institutions, universities, and tech companies to further his inventions, showcasing his ability to work across disciplines to achieve groundbreaking results.

Conclusion: Rongjun Wang's dedication to innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

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