The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jan. 22, 2024
Applied Materials, Inc., Santa Clara, CA (US);
XI Cen, San Jose, CA (US);
Kai Wu, Palo Alto, CA (US);
Yao Xu, Santa Clara, CA (US);
Yang Li, Sunnyvale, CA (US);
Meng Zhu, Santa Clara, CA (US);
Insu Ha, San Jose, CA (US);
Jianqiu Guo, San Jose, CA (US);
Chao Li, Santa Clara, CA (US);
Rongjun Wang, Dublin, CA (US);
Xianmin Tang, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of filling a via having a necking point includes performing a pre-clean process to remove residues from an exposed surface of a metal layer at a bottom of a via and recover inner surfaces of the via, wherein the via is formed within a dielectric layer and has a necking point protruding within the via, performing a selective deposition process to partially fill the via with metal fill material from the exposed surface of the metal layer below the necking point, performing a liner deposition process to form a liner layer on exposed inner surfaces of the via, and performing a metal fill process to fill the via with the metal fill material.