IDiyas

For the Inventor, By the Inventor

Palo Alto, CA, United States of America

Kai Wu

LinkedIn
USPTO Granted Patents = 37 

Average Co-Inventor Count = 5.3

ph-index = 7

Forward Citations = 727(Granted Patents)


Company Filing History:

goldMedal37 out of 13,684 
 
Applied Materials, Inc.
 patents

Years Active: 2010-2025

where 'Filed Patents' based on already Granted Patents

37 patents (USPTO):
1. 12486576 - Shadow ring lift to improve wafer edge performance (2025-12-02),
2. 12351909 - Gap fill methods using catalyzed deposition (2025-07-08),
3. 12315746 - Bottom cover plate to reduce wafer planar nonuniformity (2025-05-27),
4. D1066440 - Process chamber pumping liner (2025-03-11),
5. 12191198 - Low resistivity tungsten film and method of manufacture (2025-01-07),
6. 12159804 - Tungsten molybdenum structures (2024-12-03),
7. 12113020 - Formation of metal vias on metal lines (2024-10-08),
8. 12094773 - Methods for low resistivity and stress tungsten gap fill (2024-09-17),
9. 12037682 - Methods for forming low resistivity tungsten features (2024-07-16),
10. 12014956 - Tungsten gapfill using molybdenum co-flow (2024-06-18),
11. 11939668 - Gas delivery for tungsten-containing layer (2024-03-26),
12. 11859277 - Catalyst enhanced molybdenum deposition and gap fill (2024-01-02),
13. 11798845 - Methods and apparatus for low resistivity and stress tungsten gap fill (2023-10-24),
14. 11776806 - Multi-step pre-clean for selective metal gap fill (2023-10-03),
15. 11380536 - Multi-step pre-clean for selective metal gap fill (2022-07-05),

As a client of idiyas.com, you might find the following article interesting:

Title: The Innovations of Kai Wu - A Pioneering Inventor in Palo Alto

Introduction: Kai Wu is a standout inventor based in Palo Alto, CA, with an impressive portfolio of 27 patents to his name. His groundbreaking work in the field of gas delivery and metal film deposition has significantly impacted the semiconductor industry.

Latest Patents: Among his recent patents is a method for gas delivery for tungsten-containing layers, revolutionizing the process of forming tungsten-containing layers over substrates. Additionally, his work on catalyst-enhanced molybdenum deposition and gap fill has set a new standard for metal film deposition techniques.

Career Highlights: Kai Wu is currently affiliated with Applied Materials, Inc., a renowned company in the tech industry. His expertise and innovative solutions have played a vital role in the company's success and technological advancement. His dedication to research and development has yielded remarkable results in the semiconductor industry.

Collaborations: Working alongside talented individuals like Avgerinos V. Gelatos and Amit Khandelwal, Kai Wu has demonstrated his ability to collaborate effectively and drive innovation through teamwork. His collaborative spirit has led to the creation of cutting-edge technologies and patents.

Conclusion: In conclusion, Kai Wu's contributions to the field of semiconductor technology are truly remarkable. His inventive spirit, coupled with his expertise in gas delivery and metal film deposition, continues to push the boundaries of innovation. Keep an eye on this visionary inventor, as his future work is sure to shape the technological landscape for years to come.

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