The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Sep. 13, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zubin Huang, Santa Clara, CA (US);

Jallepally Ravi, San Ramon, CA (US);

Kai Wu, Palo Alto, CA (US);

Xiaoxiong Yuan, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 16/06 (2006.01); C23C 16/50 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4585 (2013.01); C23C 16/06 (2013.01); C23C 16/50 (2013.01); H01J 37/32715 (2013.01); H01L 21/68721 (2013.01); H01L 21/68742 (2013.01); H01L 21/76843 (2013.01); H01L 21/76876 (2013.01); H01L 21/76879 (2013.01); H01L 23/53266 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/332 (2013.01);
Abstract

A method and apparatus for processing a substrate are described herein. The methods and apparatus described enable the raising and lowering of a shadow ring within a process chamber either simultaneously with or separately from a plurality of substrate lift pins. The shadow ring is raised and lowered using a shadow ring lift assembly and may be raised to a pre-determined height above the substrate during a radical treatment operation. The shadow ring lift assembly may also raise and lower the plurality of substrate lift pins to enable both the shadow ring and the substrate lift pins to be raised to a transfer position when the substrate is being transferred into or out of the process chamber.


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