The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Jan. 02, 2024
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Zhen Liu, Santa Clara, CA (US);
Min-Han Lee, San Jose, CA (US);
Jie Zhang, Sunnyvale, CA (US);
Yongqian Gao, Sunnyvale, CA (US);
Tsung-Han Yang, San Jose, CA (US);
Rongjun Wang, Dublin, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/14 (2006.01); C23C 16/06 (2006.01); C23C 16/455 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45525 (2013.01); C23C 16/06 (2013.01); C23C 16/56 (2013.01);
Abstract
Embodiments of the disclosure relate to methods for metal gapfill of a logic device with lower resistivity. Specific embodiments provide integrated separate tungsten PVD processes with plasma-etch to solve the overhang issue caused by tungsten PVD and the high resistivity caused by nucleation.