The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Aug. 31, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zhiyong Wang, San Jose, CA (US);

Halbert Chong, San Jose, CA (US);

Irena H. Wysok, San Jose, CA (US);

Jianxin Lei, Fremont, CA (US);

Rongjun Wang, Dublin, CA (US);

Lei Zhou, San Jose, CA (US);

Kirankumar Neelasandra Savandaiah, Bangalore, IN;

Sundarapandian Ramalinga Vijayalakshmi Reddy, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/56 (2006.01); C23C 14/06 (2006.01); C23C 14/35 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/564 (2013.01); H01J 37/32862 (2013.01); H01J 37/3497 (2013.01); C23C 14/0605 (2013.01); C23C 14/35 (2013.01); C23C 16/4405 (2013.01); H01J 37/3447 (2013.01); H01J 2237/335 (2013.01);
Abstract

Methods and apparatus reduce defects in substrates processed in a physical vapor (PVD) chamber. In some embodiments, a method for cleaning a process kit disposed in an inner volume of a process chamber includes positioning a non-sputtering shutter disk on a substrate support of the PVD chamber; energizing an oxygen-containing cleaning gas disposed in the inner volume of the PVD chamber to create a plasma reactive with carbon-based materials; and heating the process kit having a carbon-based material adhered thereto while exposed to the plasma to remove at least a portion of the carbon-based material adhered to the process kit.


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