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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Rajeev Dinkar Joshi

USPTO Granted Patents = 80 

 

Average Co-Inventor Count = 1.7

ph-index = 29

Forward Citations = 2,259(Granted Patents)

Forward Citations (Not Self Cited) = 1,840(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Sunnyvale, CA (US) (1998)
  • San Jose, CA (US) (2006 - 2009)
  • Cupertino, CA (US) (1997 - 2022)

Company Filing History:

goldMedal57 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
silverMedal11 out of 29,263 
 
Texas Instruments Corporation
 patents
bronzeMedal4 out of 4,791 
 
National Semiconductor Corporation
 patents
4. 4 out of 466 
 
Flextronics Ap, LLC
 patents
5. 2 out of 354 
 
Fairchild Korea Semiconductor Ltd.
 patents
6. 1 out of 1 
 
Fiarchild Semiconductor
 patent
7. 1 out of 832,843 
Other
 patents

Years Active: 1997-2022

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Areas of Expertise:
Integrated Circuit Package
Semiconductor Package
Power Converter
Dual Leadframes
Thermal Enhanced Package
Flip Chip Applications
Magnetics Package
Wafer-Level Chip Scale Package
Multi-Chip Package
Embedded Power Stage
Photo Voltaic Assembly
RF Shielding
80 patents (USPTO):Explore Patents
1. 11430722 - Integration of a passive component in a cavity of an integrated circuit package (2022-08-30),
2. 11257739 - Semiconductor package with integrated passive electrical component (2022-02-22),
3. 10734313 - Integration of a passive component in an integrated circuit package (2020-08-04),
4. 10714412 - Semiconductor package with integrated passive electrical component (2020-07-14),
5. 10573585 - Power converter having a conductive clip (2020-02-25),
6. 10573582 - Semiconductor systems having dual leadframes (2020-02-25),
7. 10312184 - Semiconductor systems having premolded dual leadframes (2019-06-04),
8. 9468087 - Power module with improved cooling and method for making (2016-10-11),
9. 9355946 - Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips (2016-05-31),
10. 9159656 - Semiconductor die package and method for making the same (2015-10-13),
11. 9136256 - Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips (2015-09-15),
12. 9053853 - Method of forming a magnetics package (2015-06-09),
13. 8679896 - DC/DC converter power module package incorporating a stacked controller and construction methodology (2014-03-25),
14. 8664752 - Semiconductor die package and method for making the same (2014-03-04),
15. 8609978 - Leadframe based photo voltaic electronic assembly (2013-12-17),

Title: The Innovative Journey of Rajeev Dinkar Joshi

Introduction:

Rajeev Dinkar Joshi, a visionary inventor based in Cupertino, CA, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Rajeev Dinkar Joshi holds several patents in the areas of artificial intelligence, machine learning, and data analytics, showcasing his expertise in cutting-edge technologies.

Career Highlights:

With a background in computer science and engineering, Rajeev has worked for top tech companies in Silicon Valley, where he honed his skills and developed a deep understanding of emerging technologies.

Collaborations:

Throughout his career, Rajeev has collaborated with leading researchers and engineers in the industry, fostering innovation and pushing the boundaries of what is possible in the tech world.

Conclusion:

Rajeev Dinkar Joshi's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs in the ever-evolving landscape of the tech industry.

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