The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Jul. 13, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Rajeev Dinkar Joshi, Cupertino, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 21/76 (2006.01); H05K 1/02 (2006.01); H02M 7/00 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H02M 7/003 (2013.01); H05K 1/181 (2013.01); H05K 3/34 (2013.01); H05K 7/20409 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01);
Abstract

Disclosed examples include power modules and fabrication methods therefor in which one or more power device dies include a switching device and a second device die with a circuit component are mounted to a lead frame or other interconnect structure on a substrate structure, and a body structure is formed around portions of the power module providing a first opening to expose a portion of the substrate structure to provide an externally accessible first exposed surface along the top of the power module, and the body structure includes a second opening exposing a portion of the first device die along the bottom of the power module to provide a thermally conductive path to draw heat away from the power device dies.


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