The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Nov. 22, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Joyce Marie Mullenix, San Jose, CA (US);
Roberto Giampiero Massolini, Pavia, IT;
Rajeev D. Joshi, Cupertino, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 23/495 (2013.01); H01L 23/4951 (2013.01); H01L 23/49524 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49589 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32265 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor package includes a leadframe comprising input/output pins accessible external to the semiconductor package and a semiconductor die electrically connected to the leadframe. The semiconductor package also includes a passive electrical component mounted on a side of the semiconductor die opposite the leadframe. Mold compound encapsulates the passive electrical component, semiconductor die, and leadframe to form the semiconductor package. Associated methods are disclosed as well.