The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Apr. 08, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rajeev D. Joshi, Cupertino, CA (US);

Hau Nguyen, San Jose, CA (US);

Anindya Poddar, Sunnyvale, CA (US);

Ken Pham, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 23/49558 (2013.01); H01L 23/49575 (2013.01); H01L 25/16 (2013.01); H01L 23/3121 (2013.01); H01L 23/49544 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 23/49589 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A dual leadframe () for semiconductor systems comprising a first leadframe () having first metal zones separated by first gaps, the first zones including portions of reduced thickness and joint provisions in selected first locations, and further a second leadframe () having second metal zones separated by second gaps, the second zones including portions of reduced thickness and joint provisions () in selected second locations matching the first locations. The second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together. The resulting dual leadframe may further include insulating material () filling the first and second gaps and the zone portions of reduced thickness, and has insulating surfaces coplanar with the top and bottom metallic surfaces.


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