The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Sep. 05, 2013
Applicant:
Fairchild Semiconductor Corporation, San Jose, CA (US);
Inventors:
Oseob Jeon, Seoul, KR;
Yoonhwa Choi, Inchun, KR;
Boon Huan Gooi, Penang, MY;
Maria Cristina B. Estacio, Cebu, PH;
David Chong, Penang, MY;
Tan Teik Keng, Penang, MY;
Shibaek Nam, Puchon, KR;
Rajeev Joshi, Cupertino, CA (US);
Chung-Lin Wu, San Jose, CA (US);
Venkat Iyer, Redmond, WA (US);
Lay Yeap Lim, Penang, MY;
Byoung-Ok Lee, Puchon, KR;
Assignee:
Fairchild Semiconductor Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/4951 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 23/49861 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/39 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/16 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29299 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/456 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45669 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/4943 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/85013 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30107 (2013.01); Y10T 29/49121 (2015.01);
Abstract
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.