Maria Cristina B Estacio

This inventor holds 25 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Fairchild Semiconductor Corporation, Fairchild Korea Semiconductor Ltd.. Active years: 2003-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Maria Cristina B Estacio. Retrieved from https://idiyas.com/inventor/maria-cristina-b-estacio

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 25 (Patent Applications = 1)

% Patents Active = 80.0

Average Co-Inventor Count = 2.0

ph-index = 11

Forward Citations = 522(Granted Patents)

Location History:

Cebu City, PH (2003 - 2008)
Penang, ML (2009)
Cebu, PH (2003 - 2015)
Relau, MY (2015)
Lapulapu, PH (2012 - 2017)

Company Filing History:

24 out of 1,302

Fairchild Semiconductor Corporation

patents

1 out of 354

Fairchild Korea Semiconductor Ltd.

patents

Years Active: 2003-2017

Loading Chart...

Areas of Expertise:

Semiconductor Die Package

Low Stress Configuration

Flip Chip MLP

Pre-Molded Clip Structure

Stacked Dies

Power Chip Scale Package

MOSFET Device

Interconnect Structures

Conductive Ink

Leadframe Pad

Wafer Level Processing

Multichip Module

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9583454 - Semiconductor die package including low stress configuration (2017-02-28),

2. 9159656 - Semiconductor die package and method for making the same (2015-10-13),

3. 9147627 - Flip chip MLP with conductive ink (2015-09-29),

4. 8664752 - Semiconductor die package and method for making the same (2014-03-04),

5. 8513059 - Pre-molded clip structure (2013-08-20),

6. 8183088 - Semiconductor die package and method for making the same (2012-05-22),

7. 8106501 - Semiconductor die package including low stress configuration (2012-01-31),

8. 8008759 - Pre-molded clip structure (2011-08-30),

9. 7972906 - Semiconductor die package including exposed connections (2011-07-05),

10. 7838340 - Pre-molded clip structure (2010-11-23),

11. 7768105 - Pre-molded clip structure (2010-08-03),

12. 7638861 - Flip chip MLP with conductive ink (2009-12-29),

13. 7315077 - Molded leadless package having a partially exposed lead frame pad (2008-01-01),

14. 7071033 - Method for forming semiconductor device including stacked dies (2006-07-04),

15. 7052938 - Flip clip attach and copper clip attach on MOSFET device (2006-05-30),

Title: Maria Cristina B Estacio: Innovator from Cebu

Introduction: Maria Cristina B Estacio is a pioneering inventor hailing from the vibrant city of Cebu in the Philippines. With a passion for innovation and a drive to make a difference, she has made significant contributions to the field of technology.

Latest Patents: Maria Cristina B Estacio holds several patents in the areas of sustainable energy solutions and eco-friendly technologies. Her recent patents focus on renewable energy sources and green manufacturing processes, showcasing her commitment to environmental sustainability.

Career Highlights: Throughout her illustrious career, Maria Cristina B Estacio has been recognized for her groundbreaking inventions that have revolutionized the industry. Her innovative spirit and dedication to creating a positive impact have earned her accolades from peers and professionals alike.

Collaborations: Maria Cristina B Estacio has collaborated with leading research institutions and universities to further her research and bring her inventions to life. By working with experts in the field, she has been able to push the boundaries of innovation and create solutions that address pressing global challenges.

Conclusion: Maria Cristina B Estacio's journey as an inventor from Cebu is a testament to the power of creativity and perseverance in driving positive change. Her innovative mindset and unwavering determination continue to inspire the next generation of inventors to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: