The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Mar. 07, 2008
Erwin Victor R. Cruz, Koronadal, PH;
Maria Cristina B. Estacio, Cebu, PH;
Erwin Victor R. Cruz, Koronadal, PH;
Maria Cristina B. Estacio, Cebu, PH;
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A clip structure and semiconductor die package. The clip structure includes a first portion and a second portion, with a connecting structure located between the first and second portion. The clip structure is substantially planar. The semiconductor die package includes a semiconductor die located between a leadframe structure and a clip structure. Slots are formed within the molding material covering portions of the semiconductor die package. The slots are located between a first portion and the second portion of the clip structure, and the slot overlap with the semiconductor die.