The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Nov. 12, 2009
Applicants:
Seung-yong Choi, Seoul, KR;
Ti Ching Shian, Georgetown, MY;
Maria Cristina B. Estacio, Relau, MY;
Inventors:
Assignee:
Fairchild Semiconductor Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/565 (2013.01); H01L 23/4985 (2013.01); H01L 24/83 (2013.01); H01L 24/90 (2013.01); H01L 24/16 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/11822 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83194 (2013.01); H01L 2224/83907 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/14 (2013.01);
Abstract
A flip chip molded leadless package (MLP) with electrical paths printed in conducting ink. The MLP includes a pre-molded leadframe with the electrical paths printed directly thereon. The present invention also provides a method of fabricating the semiconductor package.