The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2008
Filed:
Nov. 12, 2004
Yoon-hwa Choi, Incheon Metropolitan, KR;
Shi-baek Nam, Buceon-si, KR;
O-seob Jeon, Seoul, KR;
Rajeev Dinkar Joshi, Cupertino, CA (US);
Maria Cristina B. Estacio, CebuCity, PH;
Yoon-hwa Choi, Incheon Metropolitan, KR;
Shi-baek Nam, Buceon-si, KR;
O-seob Jeon, Seoul, KR;
Rajeev Dinkar Joshi, Cupertino, CA (US);
Maria Cristina B. Estacio, CebuCity, PH;
Fairchild Korea Semiconductor, Ltd., Bucheon, KR;
Abstract
Provided are a molded leadless package, and a sawing type molded leadless package and method of manufacturing same. The molded leadless package includes a lead frame pad having first and second surfaces opposite to each other. A semiconductor chip is adhered to the first surface of the lead frame pad. A lead is electrically coupled to the semiconductor chip. A molding material covers the lead frame pad, the semiconductor chip, and the lead and exposes a portion of the lead and a portion of the second surface of the lead frame pad. A step difference is formed between a surface of the molding material covering the second surface of the lead frame pad and the second surface of the lead frame pad itself. The sawing type molded leadless package includes a short-circuit preventing member that is post-shaped or convex, and protruding from the lower surface of the die pad.