Yoon-hwa Choi

Title: Yoon-hwa Choi: Innovator in Semiconductor Packaging

Introduction

Yoon-hwa Choi is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on innovative solutions that enhance the performance and reliability of semiconductor devices.

Latest Patents

Yoon-hwa Choi's latest patents include a wafer-level chip scale package featuring stud bumps and a method for fabricating the same. This invention describes a wafer-level chip scale package that includes a silicon substrate with a passivation layer and a chip pad on its top surface. A stud bump is formed on the chip pad and encircled by a first insulating layer. Additionally, a re-distributed line (RDL) pattern is created on the same horizontal surface as the first insulating layer and the stud bump, connecting the stud bump to a solder bump. A second insulating layer insulates the RDL pattern, exposing a portion that connects with the solder bump, which is then attached to the exposed portion of the RDL pattern.

Another notable patent is for a package frame and semiconductor package that allows for the reliable attachment of a small-sized semiconductor chip requiring a large number of leads to a board while providing high heat dissipation capability. This semiconductor package includes leads with a top plate extending inward from the outside edge of a frame, along with pillar-shaped portions supporting the top plates. A semiconductor chip is attached to the edge portions of the leads, with wires connecting the leads to corresponding bonding pads on the chip. The entire assembly is encapsulated with a molding material, ensuring that the bottom surfaces of the leads remain exposed for effective heat dissipation.

Career Highlights

Yoon-hwa Choi is currently employed at Fairchild Korea Semiconductor Ltd., where he continues to innovate in the semiconductor industry. His expertise in semiconductor packaging has positioned him as a key player in the field, contributing to advancements that benefit various applications.

Collaborations

Yoon-hwa Choi has collaborated with notable coworkers, including Shi-baek Nam and O-seob Jeon. Their combined efforts have led to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Yoon-hwa Choi's contributions to semiconductor packaging through his innovative patents and collaborations highlight his importance in the field. His work continues to