The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Jun. 27, 2006
Yoon-hwa Choi, Incheon Metropolitan, KR;
Yoon-hwa Choi, Incheon Metropolitan, KR;
Abstract
Provided are a lead frame and a semiconductor package which allows reliable attachment of a small-sized semiconductor chip requiring a large number of leads to a board while providing high heat dissipation capability. The semiconductor package includes leads, each having a top plate extending inward from the outside edge of a frame and a plurality of pillar-shaped portions supporting the top plates, a semiconductor chip attached onto edge portions of the leads, wires connecting the leads with corresponding bonding pad on the semiconductor chip, and a molding material encapsulating the semiconductor chip and the wires and parts of the leads so as to the bottom surfaces of the leads are exposed. Further, some embodiments have a conductive pad exhibiting higher heat dissipation.