The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Nov. 15, 2002
Sang-do Lee, Bucheon, KR;
Yoon-hwa Choi, Incheon, KR;
Sang-do Lee, Bucheon, KR;
Yoon-hwa Choi, Incheon, KR;
Abstract
A wafer level chip scale package having stud bumps and a method for fabricating the same are described. The wafer level chip scale package includes a silicon substrate having a passivation layer and a chip pad on its top surface; a stud bump being formed on the chip pad and encircled by a first insulating layer; a re-distributed line (RDL) pattern being formed on the same horizontal surface as the first insulating layer and the stud bump, the RDL pattern for connecting the stud bump and a solder bump; a second insulating layer for insulating the RDL pattern so that a portion of the RDL pattern that is connected with the solder bump is exposed; and the solder bump being attached to the exposed portion if the RDL pattern.